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全自動硅片下料機

設備名稱 Equipment Name

全自動硅片下料機  Automatic Wafer Unloader

設備型號 Equipment Model

DP-Ⅲ/LXP-Ⅲ

設備用途 Equipment Application

DP-Ⅲ:將上?道工序片籃中的硅片自動裝入下?道工序片籃中。
DP-III:Transfer wafers from the cassette of the previous process to the cassette of next process.

LXP-Ⅲ:將5道/8道/10道在線鏈式清洗設備中生產的硅片導入片籃。
LXP-III:Unloading the wafers from the 5/8/10-lane inline cleaning equipment to cassettes. 


技術特點  Features

DP-III

1. 采用PLC控制,下片過程全自動完成;觸摸屏菜單操作,簡單明了。
With PLC control and the unloading process is completed automatically; Touch-screen operation, which is easy and clear.

2. 采用單道下片方式,保證下片生產率,同時滿足硅片按批次?產的要求。
With single lane loading/unloading method which guarantees the loading/unloading productivity and meets the requirement of the wafer production according to batches as well.

3. 采用雙工位操作換片籃不停機。
Double workstation, exchanging magazine/cassette no need to interrupt equipment operation.

4. 在線式/離線式可選。
Inline/Offline optional.

5. 匹配AGV, RFID, MES 管理功能。
Compatible with AGV, RFID, MES function optional.

  




LXP-III 
1. 采用PLC控制,下片過程全自動完成;觸摸屏菜單操作,簡單明了。
With PLC control and the unloading process is completed automatically; Touch-screen operation, which is easy and clear.

2. 可對硅片進入下片機前進行破片檢測和破片處理。(此功能需另外訂購,標準機無此功能)
Breakage detection and treatment before wafer unload to the unloader. (Extra charges )

3. 翻轉功能,稱重測試功能(此功能需另外訂購,標準機無此功能)。
Wafer turnover function, Weight testing function (need extra charges, standard equipment without this configuration)

4. 匹配AGV,RFID,MES管理功能。
Compatible with AGV,RFID, MES management function.

設備參數  Parameters


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